Configurable probe pads to facilitate parallel testing of integr

Details Configurable probe pads to facilitate parallel testing of integr Configurable probe pads to facilitate parallel testing of integr

1997-06-20

1999-04-20

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3128

Patent

active

058960406

ABSTRACT:
Parallel testing of integrated circuit devices are facilitated such that it is not necessary that integrated circuit devices to be parallel tested be "ends only" devices. A side pad located along the sides, rather than the ends, of the integrated circuit device is electrically connected by multiplexing circuitry to a corresponding configurable probe pad located along the ends of the device. During parallel testing of the device, the side pad is effectively tested when the configurable probe pad is probed and tested. While the configurable probe pad is tested during parallel testing, the side pad is not directly exercised. Following parallel testing, the side pad is bonded to the device package but the configurable probe pad is not bonded to the device package.

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