Configurable multi-chip module interconnect

Details Configurable multi-chip module interconnect Configurable multi-chip module interconnect

1991-08-26

1993-04-06

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 361414, 361412, H05K 100

Patent

active

052005801

ABSTRACT:
A multi-chip module interconnect structure is configurable for a desired application. A power/ground layer and one of two signal interconnect layers have a fixed metal pattern and are generated once for multiple applications. A second signal interconnect layer and a bond pad layer are custom designed for the particular application. The fixed interconnect layer has a repeating pattern of horizontal metal strips in rows and of three different lengths. The end points of each row of strips are staggered to increase routeability by reducing vertical blockage. Power distribution and ground rails are periodically positioned in the repeating pattern to provide current to the power/ground layer. A custom router generates the second signal interconnect layer for the particular application involved.

REFERENCES:
patent: 4362899 (1982-12-01), Borrill
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4899439 (1990-02-01), Potter et al.
patent: 4920639 (1990-05-01), Yee
patent: 5072075 (1991-12-01), Lee et al.
Jarvela, R. A. and M. J. Jesrani, Wirability Enhancement, IBM Disclosure Bulletin, vol. 21, No. 9, Feb. 1979, p. 3624.

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