Configurable microelectronic package using electrically...

Details Configurable microelectronic package using electrically... Configurable microelectronic package using electrically...

2007-04-03

2007-04-03

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

10235630

ABSTRACT:
Apparatus and methods are provided to enable circuit configuration of a substrate by the setting of settable bits associated with those circuits. An electrically conductive material is deposited onto selected settable bits which closes the desired circuit between the settable bits. In one embodiment in accordance with the invention, a carrier substrate is provided that comprises settable bits which are used to control a microelectronic package's electrical characteristics. In one embodiment, the settable bits are in the form of sets of spaced-apart bit pads which form an open circuit between a logic circuit and electrical ground (Vss). The open circuit is closed with the application of electrically conductive material that bridges the set of spaced-apart bit pads. The settable bits, therefore, do not require the addition of high profile components such as 0-ohm resisters to form the electrical bridging function between the bit pads of a settable bit. The settable bits provide a highly configurable control interface that allows the setting of one or more electrical characteristics. The settable bits are easily and quickly configurable and do not require complex customized machinery for implementation. Further, they do not significantly add to the cost of development or manufacture of the carrier substrate.

REFERENCES:
patent: 5264664 (1993-11-01), McAllister et al.
patent: 5308928 (1994-05-01), Parla et al.
patent: 5455760 (1995-10-01), Bilas et al.
patent: 6274824 (2001-08-01), Rueda-Aguilocho et al.
patent: 6320139 (2001-11-01), Byle et al.

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