Conductor-within-a-via microwave launch

Details Conductor-within-a-via microwave launch Conductor-within-a-via microwave launch

2005-08-30

2005-08-30

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S260000, C174S266000

Reexamination Certificate

active

06937120

ABSTRACT:
A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.

REFERENCES:
patent: 5508666 (1996-04-01), Nguyen
patent: 5668509 (1997-09-01), Hoffmeister et al.
patent: 5797765 (1998-08-01), Barnett et al.
patent: 6166705 (2000-12-01), Mast et al.
patent: 6441697 (2002-08-01), Garland et al.
patent: 6617526 (2003-09-01), Miller

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