Conductor paste for plugging through-holes in ceramic circuit bo

Details Conductor paste for plugging through-holes in ceramic circuit bo Conductor paste for plugging through-holes in ceramic circuit bo

1997-09-03

1999-07-13

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, 106 113, 106 115, H01B 122

Patent

active

059222450

ABSTRACT:
A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

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Mohri et al., Control Of Through-Hole In Low Temperature Fired Substrate With Alumina Substrate Core, Jun., 1993, pp. 95-98, Japan. (No Month).

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