Conductor paste for plugging through-holes in ceramic circuit bo

Details Conductor paste for plugging through-holes in ceramic circuit bo Conductor paste for plugging through-holes in ceramic circuit bo

1996-03-26

1997-12-16

Lam, Cathy F.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 114, 106 115, 428210, 428325, 428328, 428434, 428469, 428471, 428472, 428669, 252518, 252521, B22F 700, C09D 500, B32B 300, B32B 1800

Patent

active

056980159

ABSTRACT:
A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.

REFERENCES:
patent: 3502489 (1970-03-01), Cole
patent: 3827891 (1974-08-01), Larry
patent: 4766027 (1988-08-01), Burn
patent: 4835039 (1989-05-01), Barringer et al.
patent: 4861646 (1989-08-01), Barringer et al.
Mohri et al., Control of through-hole in Low Temperature Fired Substrate with Alumina Substrate Core, Jun. 1993, pp. 95-98 Japan.

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