Conductor film and its forming method

Details Conductor film and its forming method Conductor film and its forming method

1996-08-06

1999-02-23

Evans, Elizabeth

Stock material or miscellaneous articles

Composite

Of quartz or glass

428432, 428651, 428699, 156101, 1562755, B32B 1706

Patent

active

058741747

ABSTRACT:
When forming a conductor film of Ag, Au, Cu, Al on a substrate of ceramics or glass, an adhesive layer of Cr, NiCr is formed on the substrate, a mixed layer of adhesive layer material and conductor film material is formed on the adhesive layer, and a conductor film is formed on the mixed layer. According to this method, even if film forming is conducted below the temperature for inducing diffusion on the interface of the conductor film and adhesive layer, for example, below 100.degree. C., an alloy layer of adhesive layer material and conductor film material is present on the interface of the adhesive layer and conductor film to be closer to bulk state, and the attraction between molecules is increased, so that the bonding strength of the conductor film and adhesive layer is enhanced. Therefore, at 100.degree. C. or more, a conductor film which hardly causes peeling may be formed on the substrate to be used in electronic components which vary in electric characteristics or on the film form substrate which deforms thermally.

REFERENCES:
patent: 5578657 (1996-11-01), Inoue et al.
patent: 5616423 (1997-04-01), Saniyou et al.
patent: 5653837 (1997-08-01), Tabuki et al.
"Sputtering Phenomenon" by Akira Kanehara, published by Tokyo University Shuppankai.
"Thin Film Technology" Shigeru Hayakawa et al., published by Kyoritsu Shuppan K.K.

Affiliated with

Also associated with

Rating

Conductor film and its forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductor film and its forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductor film and its forming method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-305032