Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1993-12-07
1995-12-12
Yoon, Tae H.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524440, 252511, 252512, 252513, 252514, C08K 308, H01B 102
Patent
active
054750482
ABSTRACT:
Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.
REFERENCES:
patent: 3903027 (1975-09-01), Johnson
patent: 4288571 (1981-09-01), Comstock et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 4767806 (1988-08-01), Cesare et al.
patent: 5158708 (1992-10-01), Yamamoto et al.
patent: 5250228 (1993-10-01), Baigrie et al.
"An Overview of Soldering and Solder Paste: Technology and Applications", Hybrid Circuit Technology, by J. S. Hwang, Sep. 1989, pp. 27-32.
"Conductive Epoxy Is Tested For SMT Solder Replacement", Electronic Packaging and Production, by R. Pound, Feb., 1986.
Hysol Electronics Chemicals Technical Information Bulletin E6-232C, Hysol Electronic Chemicals, Jul. 1986.
Hysol Electronics Chemicals Technical Information Bulletin E6-233A, Hysol Electronic Chemicals, Mar. 1987.
"Polyurethane Low Profile Additives For RP", by K. B. Chandalia, et al., 38th Annual Conference, Reinforced Plastics/Composites Institute, The Society of the Plastics Industry, Inc., Feb. 7-11, 1983.
Urralloy.RTM. Hybrid Polymer LP 85-05 Product Data Sheet, Olin Chemicals, 1986.
High Purity Silver Powder & Silver Flake, Amepox Product Literature, 1991.
Jamison William L.
Moscicki Andrzej
Thermoset Plastics, Inc.
Yoon Tae H.
LandOfFree
Conductor-filled thermosetting resin does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductor-filled thermosetting resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductor-filled thermosetting resin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1360345