Conductor compositions

Compositions – Electrically conductive or emissive compositions – Free metal containing

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Details

252518, 252519, 106 113, 106 114, 106 115, 428432, 428434, H01B 102

Patent

active

044141432

ABSTRACT:
Palladium/silver metallizations having excellent solderability and aged adhesion are obtained by substituting for the palladium copper and/or certain transition metals or binary metal oxides and concommitantly reducing the amount of inorganic binder.

REFERENCES:
patent: 3763409 (1973-10-01), Sheard
patent: 3838071 (1974-09-01), Amin
patent: 4001146 (1977-01-01), Horowitz
patent: 4090009 (1978-05-01), Horowitz

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