Conductor ball mounting apparatus, conductor ball mounting...

Details Conductor ball mounting apparatus, conductor ball mounting... Conductor ball mounting apparatus, conductor ball mounting...

2011-01-11

2011-01-11

Le, Emily M (Department: 1793)

Metal fusion bonding

Process

Plural joints

Reexamination Certificate

active

07866534

ABSTRACT:
There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.

REFERENCES:
patent: 2002/0058406 (2002-05-01), Mukuno et al.
patent: 02238693 (1990-09-01), None
patent: 2000-332044 (2000-11-01), None
patent: 2004-165492 (2004-06-01), None
patent: 2006-073999 (2006-03-01), None
English Machine Translation of JP 2004-165492 Murayama et al.

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