Conductive tape for semiconductor package, a lead frame without

Details Conductive tape for semiconductor package, a lead frame without Conductive tape for semiconductor package, a lead frame without

1991-01-23

1993-07-13

Wojciechowicz, Edward

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428354, 257668, 257670, B32B 712, H01L 2348

Patent

active

052272320

ABSTRACT:
A conductive tape for a packaged semiconductor device is disclosed. The tape contains a first adhesive layer, a base film on top of the first adhesive layer, a conductive layer on top of the base film layer, and a second adhesive layer on top of the conductive layer. Metal may form the conductive layer. The tape may have slits, slots, or apertures in it so that electrical connection may be made to the conductive layer. Such a tape is useful in lead on chip integrated circuit packages to connect the semiconductor die to the lead frame and to function as a power supply bus by transferring power to the semiconductor die. Wire bonds extending through slots in the second adhesive layer form electrical connection from the lead fingers for receiving power to the conductive layer of the tape. Wire bonds extending from the bonding pads of the semiconductor die through slots the second adhesive layer form electrical connection from the semiconductor die to the conductive layer.

REFERENCES:
patent: 4727221 (1988-02-01), Saitou et al.
patent: 4862245 (1989-08-01), Pashby
patent: 4916519 (1990-04-01), Ward
patent: 4965654 (1990-10-01), Karner et al.
patent: 5032895 (1991-07-01), Horiuchi et al.
patent: 5091251 (1992-02-01), Sakumoto et al.

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