Conductive solder pad for bonding an electronic device to a cera

Details Conductive solder pad for bonding an electronic device to a cera Conductive solder pad for bonding an electronic device to a cera

1995-10-12

1996-08-06

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 361771, H05K 109

Patent

active

055435831

ABSTRACT:
A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.

REFERENCES:
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5145532 (1992-09-01), Fukunagawa et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5307508 (1994-04-01), Rollins et al.
patent: 5317308 (1994-05-01), Tribbey et al.
patent: 5381307 (1995-01-01), Hertz et al.

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