Conductive sintered compact for fixing electrodes in...

Details Conductive sintered compact for fixing electrodes in... Conductive sintered compact for fixing electrodes in...

2007-11-27

2007-11-27

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C252S514000, C252S500000

Reexamination Certificate

active

10855038

ABSTRACT:
A conductive sintered compact for fixing electrodes inside an electronic device envelope is provided. The sintered compact is made of a conductive composition calcined. The conductive composition includes at least 10 vol % to 60 vol % of Ag particles, a low melting-point glass containing 10 vol % to 80 vol % of B2O3, 0 vol % to 70 vol % of ceramic particles, and a metal oxide series pigment. The total amount of the ceramic particles and the metal oxide series pigment is at least 10 vol % or more.

REFERENCES:
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patent: 2003/0102465 (2003-06-01), Nagai et al.
patent: 2003/0201428 (2003-10-01), Fukushima et al.
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patent: 07-254360 (1995-10-01), None
patent: 11-329072 (1999-11-01), None
patent: 2000-048642 (2000-02-01), None
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Patent Abstracts Of Japan, Abstract for Japanese Patent Laid-Open Publication No. 07-254360, Oct. 3, 1995.
Patent Abstracts Of Japan, Abstract for Japanese Patent Laid-Open Publication No. 03-152837, Jun. 28, 1991.
Patent Abstracts Of Japan, Abstract for Japanese Patent Laid-Open Publication No. 11-329072, Nov. 30, 1999.
Patent Abstracts Of Japan, Abstract for Japanese Patent Laid-Open Publication No. 2000-48642, Jul. 24, 1998.

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