Conductive silver paste and conductive film formed using the...

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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C427S096400

Reexamination Certificate

active

11068829

ABSTRACT:
A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 μm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 μm, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.

REFERENCES:
patent: 5227093 (1993-07-01), Cole et al.
patent: 2001/0050357 (2001-12-01), Krohn
patent: 2005/0239947 (2005-10-01), Greenhill
patent: 62-145601 (1987-06-01), None
patent: 01-031874 (1989-02-01), None
patent: 5-159987 (1993-06-01), None
patent: 11-066953 (1999-03-01), None
patent: 2000-053733 (2000-02-01), None
patent: 2000-239636 (2000-09-01), None
patent: 2002-161123 (2002-06-01), None
patent: 2002-299833 (2002-10-01), None
patent: 2002-299833 (2002-10-01), None
patent: 2002-329945 (2002-11-01), None
patent: 2003-203522 (2003-07-01), None
U.S. Appl. No. 60/548,431, filed Feb. 27, 2004.

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