Conductive resinous composites

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252513, 252518, 252519, 252520, H01B 106

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046108084

ABSTRACT:
This invention is directed to resinous compositions which are generally metal-filled and which also contain hard filler materials. This combination produces unexpectedly better electrical conductivity than metal-filled material without the hard filler materials. Meanwhile there can be retained the resinous composition's ability to be quickly fabricated by simple molding technique into structurally sound rigid articles which are electrically conductive.

REFERENCES:
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patent: 3491056 (1970-01-01), Saunders et al.
patent: 3708387 (1973-01-01), Turner et al.
patent: 3867315 (1975-02-01), Tigner et al.
patent: 3919122 (1975-11-01), Tigner
patent: 4138369 (1979-02-01), Arai et al.
patent: 4230604 (1980-10-01), Wingrave
patent: 4382024 (1983-05-01), Seamon et al.
patent: 4490283 (1984-12-01), Kleiner
Mukhopadhyay, Journal of Applied Polymer Science 20, pp. 2575-2580 (1976).
Bhattacharyya et al., Polymer Engineering and Science 19, pp. 533-544 (1979).
Applicant's copending U.S. patent application Ser. No. 238,757, filed Feb. 27, 1981 and Ser. No. 332,000 filed Dec. 18, 1981.

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