Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
2004-03-05
2010-12-28
Smith, Duane (Department: 1797)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C524S495000, C429S129000, C252S511000, C252S512000, C252S513000
Reexamination Certificate
active
07858696
ABSTRACT:
An object of the present invention is to provide a conductive resin composition which does not cause problems with regard to moldability such as occurrence of separation between a resin component and a conductive filler, voids and warp on molding, and is excellent in filling of a resin into a mold, and is also capable of being used for various electrical and electronic materials, including a separator for a fuel cell having excellent properties. To achieve the above object, the present invention provides a conductive resin composition comprising a conductive filler (A); a urethane-modified epoxy (meth)acrylate (B) obtained by reacting an epoxy (meth)acrylate (b-1), which is obtained by the addition reaction of an epoxy resin having an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and a (meth)acrylic acid, with a polyisocyanate (b-2); a (meth)acrylate (C) having a number average molecular weight of 500 to 10,000, which contains 20 to 80% by weight of an aromatic cyclic structural unit and/or an aliphatic cyclic structural unit and contains no active hydrogen atom; and the other ethylenically unsaturated monomer (D) which is copolymerizable with the urethane-modified epoxy (meth)acrylate (B) and the (meth)acrylate (C).
REFERENCES:
patent: 4205018 (1980-05-01), Nagasawa et al.
patent: 4548689 (1985-10-01), Sakashita et al.
patent: 4618658 (1986-10-01), Hefner et al.
patent: 5886082 (1999-03-01), Numa et al.
patent: 6054536 (2000-04-01), Brown et al.
patent: 6251308 (2001-06-01), Butler
patent: 6306995 (2001-10-01), Wang
patent: 6429236 (2002-08-01), Carlson et al.
patent: 6441060 (2002-08-01), Hendershot et al.
patent: 6613849 (2003-09-01), Walker et al.
patent: 6764624 (2004-07-01), Saito et al.
patent: 7132460 (2006-11-01), Fujimoto et al.
patent: 7268172 (2007-09-01), Bach et al.
patent: 2001/0049046 (2001-12-01), Butler
patent: 2002/0005508 (2002-01-01), Butler et al.
patent: 2002/0055030 (2002-05-01), Okumura et al.
patent: 2002/0086198 (2002-07-01), Ilno et al.
patent: 2002/0132118 (2002-09-01), Hirai et al.
patent: 2002/0182473 (2002-12-01), Blunk et al.
patent: 2003/0013798 (2003-01-01), Iino et al.
patent: 2003/0042468 (2003-03-01), Butler
patent: 1 189 297 (2002-03-01), None
patent: 59-71322 (1984-04-01), None
patent: 61-009424 (1986-01-01), None
patent: 61-009424 (1986-01-01), None
patent: 61-009424 (1986-01-01), None
patent: 03-199230 (1991-08-01), None
patent: 7-252349 (1995-10-01), None
patent: 2000-351843 (2000-12-01), None
patent: 2001-64340 (2001-03-01), None
patent: 2001-151833 (2001-06-01), None
patent: 2001-520245 (2001-10-01), None
patent: 2002-60639 (2002-02-01), None
patent: 2002-164063 (2002-06-01), None
patent: 2003-22816 (2003-01-01), None
patent: 2003-524862 (2003-08-01), None
patent: 99/19389 (1999-04-01), None
Hamada Kenichi
Harada Tetsuya
Kato Toshiya
Yasumura Takashi
DIC Corporation
Edwards Angell Palmer & & Dodge LLP
Smith Duane
Wu Ives
LandOfFree
Conductive resin composition, process for production... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive resin composition, process for production..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive resin composition, process for production... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4160869