Conductive resin composition and electrode substrate using...

Details Conductive resin composition and electrode substrate using... Conductive resin composition and electrode substrate using...

2006-04-18

2006-04-18

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S512000, C338S118000, C338S160000

Reexamination Certificate

active

07029604

ABSTRACT:
A method of the invention manufactures a conductive resin composition having powdered silver and a reinforcing agent of the Mohs hardness 3.5 to 4.5 contained in binder resin, and forms an electrode substrate by use of the conductive resin composition. Thereby, hardness balance between phosphor copper and an electrode is regulated into the most appropriate state, and a wear resistance of both can be enhanced.

REFERENCES:
patent: 3750243 (1973-08-01), Prentice
patent: 6406774 (2002-06-01), Banba et al.
patent: 57-98572 (1982-06-01), None
patent: 5-109573 (1993-04-01), None
patent: 7-247470 (1995-09-01), None
English translation of JP 05-109573 (Apr. 1993).
English translation of JP 57-098572 (Jun. 1982).

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