Conductive powder coating materials and process for the preparat

Details Conductive powder coating materials and process for the preparat Conductive powder coating materials and process for the preparat

1994-10-26

1995-09-05

McGinty, Douglas J.

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428323, 428332, 428402, 428409, 428408, 428922, 252502, 252506, 252510, 252511, 252518, 252507, 252509, 252519, 252520, 252521, 430137, 430108, B32B 516, G03G 505, G03G 507, H01H 112

Patent

active

054477913

ABSTRACT:
Submicron to micron sized conductive particles, on the order of 0.05 to 5 micron in average particle diameter, are produced using a semisuspension polymerization process in which the aqueous phase of the suspension contains an inorganic salt such as potassium iodide. The inorganic salt inhibits the formation of polymer particles that do not contain conductive filler so as to be non-conductive. The process also allows for conductive filler to be added at the start of the process. Powder coatings made from the submicron sized conductive particles have a high and uniform conductivity.

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