Conductive powder applying device immersing substrate into...

Details Conductive powder applying device immersing substrate into... Conductive powder applying device immersing substrate into...

2005-05-03

2005-05-03

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S248100, C118S640000

Reexamination Certificate

active

06886733

ABSTRACT:
A conductive powder is stored at a predetermined position in a tank. At least one substrate is placed at a predetermined position opposite the conductive powder in the tank. The tank is rotated so as to immerse the substrate into the conductive powder. Thereby, the conductive powder is applied to the substrate.

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