Conductive polyphenylene ether-polyamide composition, method...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C525S09200D, C525S09200D, C525S088000, C525S089000, C524S495000

Reexamination Certificate

active

07022776

ABSTRACT:
A conductive thermoplastic composition includes specific amounts of a polyphenylene ether copolymer, a polyamide, and an electrically conductive filler. The composition exhibits excellent high-temperature dimensional stability and impact strength, and it is particularly useful for molding automotive body panels that are subsequently electrostatically painted.

REFERENCES:
patent: 3257357 (1966-06-01), Stamatoff
patent: 3257358 (1966-06-01), Stamatoff
patent: 3306874 (1967-02-01), Hay
patent: 3306875 (1967-02-01), Hay
patent: 3379792 (1968-04-01), Finholt
patent: 3428699 (1969-02-01), Schleimer
patent: 3756999 (1973-09-01), Stetter et al.
patent: 3822227 (1974-07-01), Hermann et al.
patent: 3876721 (1975-04-01), Yasui et al.
patent: 3884882 (1975-05-01), Caywood, Jr.
patent: 3914266 (1975-10-01), Hay
patent: 4011200 (1977-03-01), Yonemitsu et al.
patent: 4028341 (1977-06-01), Hay
patent: 4038343 (1977-07-01), Yonemitsu et al.
patent: 4054612 (1977-10-01), Yagi et al.
patent: 4147740 (1979-04-01), Swiger et al.
patent: 4174358 (1979-11-01), Epstein
patent: 4226991 (1980-10-01), Nakahara et al.
patent: 4251644 (1981-02-01), Joffrion
patent: 4315086 (1982-02-01), Ueno et al.
patent: 4346194 (1982-08-01), Roura
patent: 4474927 (1984-10-01), Novak
patent: 4565684 (1986-01-01), Tibbetts et al.
patent: 4566990 (1986-01-01), Liu et al.
patent: 4572813 (1986-02-01), Arakawa
patent: 4600741 (1986-07-01), Aycock et al.
patent: 4642358 (1987-02-01), Aycock et al.
patent: 4663230 (1987-05-01), Tennent
patent: 4681915 (1987-07-01), Bates et al.
patent: 4742115 (1988-05-01), Mawatari et al.
patent: 4774355 (1988-09-01), Omori et al.
patent: 4798865 (1989-01-01), Grant et al.
patent: 4806297 (1989-02-01), Brown et al.
patent: 4806602 (1989-02-01), White et al.
patent: 4816289 (1989-03-01), Komatsu et al.
patent: 4826933 (1989-05-01), Grant et al.
patent: 4857575 (1989-08-01), van der Meer et al.
patent: 4866114 (1989-09-01), Taubitz et al.
patent: 4874810 (1989-10-01), Lee et al.
patent: 4876078 (1989-10-01), Arakawa et al.
patent: 4923924 (1990-05-01), Grant et al.
patent: 4927894 (1990-05-01), Brown
patent: 4935472 (1990-06-01), Brown et al.
patent: 4957966 (1990-09-01), Nishio et al.
patent: 4980424 (1990-12-01), Sivavec
patent: 5017652 (1991-05-01), Abe et al.
patent: 5024818 (1991-06-01), Tibbetts et al.
patent: 5041504 (1991-08-01), Brown et al.
patent: 5055606 (1991-10-01), Fisch et al.
patent: 5057622 (1991-10-01), Chisholm et al.
patent: 5069818 (1991-12-01), Aycock et al.
patent: 5089566 (1992-02-01), Brown et al.
patent: 5109052 (1992-04-01), Kasai et al.
patent: 5112907 (1992-05-01), Nishio et al.
patent: 5115042 (1992-05-01), Khouri et al.
patent: 5120801 (1992-06-01), Chambers
patent: 5159004 (1992-10-01), Furata et al.
patent: 5159018 (1992-10-01), Nishio et al.
patent: 5165909 (1992-11-01), Tennent et al.
patent: 5198486 (1993-03-01), Chisolm et al.
patent: 5237002 (1993-08-01), Nishio et al.
patent: 5248728 (1993-09-01), Lee, Jr.
patent: 5262478 (1993-11-01), Nishio et al.
patent: 5324782 (1994-06-01), Lee, Jr.
patent: 5331060 (1994-07-01), Aycock et al.
patent: 5397822 (1995-03-01), Lee, Jr.
patent: 5397838 (1995-03-01), Ohtomo et al.
patent: 5534600 (1996-07-01), Bailly et al.
patent: 5554693 (1996-09-01), Ohtomo et al.
patent: 5589152 (1996-12-01), Tennent et al.
patent: 5591312 (1997-01-01), Smalley
patent: 5591382 (1997-01-01), Nahass et al.
patent: 5591832 (1997-01-01), Koshijima et al.
patent: 5596040 (1997-01-01), Miya et al.
patent: 5641455 (1997-06-01), Rosenlund et al.
patent: 5643502 (1997-07-01), Nahass et al.
patent: 5760125 (1998-06-01), Ohtomo et al.
patent: 5830326 (1998-11-01), Iijima
patent: 5843340 (1998-12-01), Silvi et al.
patent: 5919429 (1999-07-01), Tanaka et al.
patent: 5977240 (1999-11-01), Lohmeijer et al.
patent: 6171523 (2001-01-01), Silvi et al.
patent: 6183714 (2001-02-01), Smalley et al.
patent: 6221283 (2001-04-01), Dharmarajan et al.
patent: 6277907 (2001-08-01), Gelbin
patent: 6352654 (2002-03-01), Silvi et al.
patent: 6353050 (2002-03-01), Bastiaens et al.
patent: 6469093 (2002-10-01), Koevoets et al.
patent: 6500895 (2002-12-01), Bastiaens et al.
patent: 6528572 (2003-03-01), Patel et al.
patent: 2001/0031831 (2001-10-01), Miyoshi et al.
patent: 2002/0040090 (2002-04-01), Kurasawa et al.
patent: 153074 (1985-08-01), None
patent: 231626 (1987-08-01), None
patent: 337 814 (1989-10-01), None
patent: 337814 (1989-10-01), None
patent: 0 506 386 (1992-03-01), None
patent: 627466 (1994-12-01), None
patent: 0 673 974 (1995-09-01), None
patent: 0 675 165 (1995-10-01), None
patent: 0 866 098 (1998-09-01), None
patent: 0 924 261 (1999-06-01), None
patent: 2001-302905 (2001-10-01), None
patent: WO 94/23433 (1994-10-01), None
patent: WO 97/03954 (1997-02-01), None
patent: WO 97/45482 (1997-12-01), None
patent: WO 01/36536 (2001-05-01), None
JP 2001-302905 (abstract and translation in English).
“Plastic Additives Handbook, 5th Edition” Hans Zweifel, Ed., Carl Hanser Verlag Publishers, Munich, 2001. pp. 914-935.
“Preparation and Reactions of Epoxy-Modified Polyethylene”, J. Appl. Poly. Sci., vol. 27, pp. 425-437 (1982).

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