Conductive polymer film bonding technique

Details Conductive polymer film bonding technique Conductive polymer film bonding technique

1997-04-21

1999-05-11

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257746, 257778, H01L23/48

Patent

active

059030569

ABSTRACT:
The specification describes a thermocompression bonding process using anisotropic conductive film (ACF) bonding material in which the bonding pads are shaped to prevent depletion of conductive particles in the bonding region during compression. The process is useful in bump technology for interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The shaped structure can be made using photodefinable polymer strips around the bonding pads where the strips are thicker than the bonding pad. Alternative approaches to shaping one or both of the mating conductive surfaces are disclosed.

REFERENCES:
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5136365 (1992-08-01), Pennisi et al.

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