Compositions – Electrically conductive or emissive compositions – Metal compound containing
Patent
1992-04-28
1994-02-01
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Metal compound containing
252512, 252513, 252520, 252521, 106 113, 106 123, H01B 100, H01B 102, H01B 106, H01B 108
Patent
active
052830071
ABSTRACT:
An electrically conductive thick film resin composition comprising finely divided particles of (1) a conductive metal dispersed in a liquid organic medium comprising (2) acrylic polymer primary binder and (3) network resin auxiliary binder having a thermal degradation temperature of at least 300 C. dissolved in (4) volatile organic solvent.
REFERENCES:
patent: 3922387 (1975-11-01), Larry
patent: 4075681 (1978-02-01), Popowich
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4595606 (1986-06-01), St. John et al.
Inaba Akira
Oba Takayuki
Yamamoto Yasuo
E. I. Du Pont de Nemours and Company
Kopec M.
Lieberman Paul
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