Conductive polymer compositions

Compositions – Electrically conductive or emissive compositions – Metal compound containing

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252512, 252513, 252520, 252521, 106 113, 106 123, H01B 100, H01B 102, H01B 106, H01B 108

Patent

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052830071

ABSTRACT:
An electrically conductive thick film resin composition comprising finely divided particles of (1) a conductive metal dispersed in a liquid organic medium comprising (2) acrylic polymer primary binder and (3) network resin auxiliary binder having a thermal degradation temperature of at least 300 C. dissolved in (4) volatile organic solvent.

REFERENCES:
patent: 3922387 (1975-11-01), Larry
patent: 4075681 (1978-02-01), Popowich
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4595606 (1986-06-01), St. John et al.

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