Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
Patent
1993-06-29
1995-01-17
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Elemental carbon containing
252512, 252513, 252514, 219541, 219546, 219547, 219553, 264104, 264105, 264234, 264347, 524779, H01B 100, H01B 120, H01B 122, H01B 124
Patent
active
053823842
ABSTRACT:
A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15.degree. C./minute to the cure temperature.
REFERENCES:
patent: 4188276 (1980-02-01), Lyons et al.
patent: 4237441 (1980-12-01), van Konynenburg et al.
patent: 4238812 (1980-12-01), Middleman et al.
patent: 4317027 (1982-02-01), Middleman et al.
patent: 4352083 (1982-09-01), Middleman et al.
patent: 4388607 (1983-06-01), Toy et al.
patent: 4413301 (1983-11-01), Middleman et al.
patent: 4507340 (1985-03-01), Rinde et al.
patent: 4534889 (1985-08-01), van Konynenburg et al.
patent: 4545926 (1985-10-01), Fouts et al.
patent: 4560498 (1985-12-01), Hormsa et al.
patent: 4645805 (1987-02-01), Gaku et al.
patent: 4656208 (1987-04-01), Chu et al.
patent: 4661559 (1987-04-01), Gardner et al.
patent: 4853165 (1989-08-01), Rosenzweig et al.
patent: 4935156 (1990-06-01), van Konynenburg et al.
patent: 4962162 (1990-10-01), Kosuda et al.
patent: 4966729 (1990-10-01), Carmona et al.
patent: 5049850 (1991-09-01), Evans et al.
patent: 5106540 (1992-04-01), Barma et al.
Saechtling International Plastics Handbook for the Technologist, Engineer and User, 2d edition, 1987, pp. 1-2.
Engineered Materials Handbook, Engineering Plastics, vol. 2, pp. 240-241 1988.
30th National SAMPE Symposium, Mar. 19-21, 1985, "Chemical Modification of Matrix Resin Networks With Engineering Thermoplastics II Morphology and Properties of Poly(Aryl Ether Sulfone) Modified Epoxy Networks" (Hedrick et al).
29th National SAMPE Symposium, Apr. 3-5, 1984, "Development of Resins for Damage Tolerant Composites--A Systematic Approach" (Diamant et al).
Journal of Applied Polymer Science, vol. 22, pp. 3511-3524, 1978, "Thermoplastic-Thermosetting Hybrid Polymer Systems as Gap Filling Adhesives" (Aharoni et al).
British Polymer Journal, vol. 15, Mar. 1983, "The Addition of Polyethersulphone to Epoxy Resins" (Bucknall et al).
Journal of Applied Polymer Science, vol. 22, pp. 3511-3524, 1978, "Thermoplastic-Thermosetting Hybrid Polymer Systems as Gap Filling Adhesives" (Aharoni et al).
Baigrie Stephen
Chu Edward F.
Park George B.
Reddy Vijay N.
Rinde James A.
Burkard Herbert G.
Gerstner Marguerite E.
Kopec M.
Lieberman Paul
Raychem Corporation
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