Conductive polymer ball attachment for grid array semiconductor

Details Conductive polymer ball attachment for grid array semiconductor Conductive polymer ball attachment for grid array semiconductor

1996-04-16

1998-06-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361748, 361757, 361803, 257787, 257687, 257737, 174 521, 174 522, 439 91, 439591, H05K 114

Patent

active

057610487

ABSTRACT:
According to the present invention, a method is provided for attaching a package substrate to a circuit board. In one version of the invention, the package substrate has a semiconductor die disposed thereon, and the semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on the package substrate. In one embodiment of the invention, the method comprises the steps of attaching a first surface of an electrical connector to one of the conductive traces by thermoplastic adhesion; and attaching a second surface of the electrical connector to a conducting pad on the circuit board, also by thermoplastic adhesion.

REFERENCES:
patent: 5541450 (1996-07-01), Jones et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5666270 (1997-09-01), Matsuda et al.

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