Conductive polishing pad with anode and cathode

Details Conductive polishing pad with anode and cathode Conductive polishing pad with anode and cathode

2005-05-17

2005-05-17

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S286000, C451S287000, C451S288000, C451S446000, C451S908000

Reexamination Certificate

active

06893328

ABSTRACT:
A conductive polishing pad that includes one or more anodes and one or more cathodes formed at or near the polishing surface of a polishing pad. The anodes and cathodes are connected to a wiring network that is part of an electrical connector system that allows for a current source to be connected to the polishing pad and provide a current to the anodes and cathodes even if the polishing pad is moving relative to the current source. An electrolytic polishing fluid introduced between the polishing surface and the metal layer of a wafer forms an electrical circuit between the anode, cathode and the metal layer. The conductive polishing pad allows for electrochemical mechanical polishing (ECMP) to be performed on a conventional chemical mechanical polishing (CMP) tool.

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