Conductive plug forming method using laser planarization

Details Conductive plug forming method using laser planarization Conductive plug forming method using laser planarization

1991-07-26

1992-05-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437187, 437198, H01L 21268

Patent

active

051107597

ABSTRACT:
In a conductive plug forming method, a conductor layer is formed on the main surface of an insulator layer, only in the vicinity of a plurality of adjacent via holes in which plugs are to be formed, the conductor layer having a periphery defining a boundary encompassing the plurality of adjacent via holes. The volume of the material of the conductor layer within the boundary is of a predetermined amount, ranging from a minimum volume approximately equal to, to a maximum volume approximately equal to two times the total interior volume of the via holes. An energy beam is irradiated on the conductor layer to melt the conductor layer, so that the melted conductor material of the conductor layer flows toward and into the via holes, thereby forming a conductive plug in each of the via holes and without leaving any conductor layer material on the main surface of the substrate. The plurality of adjacent via holes may include at least first and second via holes of the same or different volume, and which may have the same or different depths in the insulator layer and/or areas in the plane of the main surface of the insulator layer. Multiple layer structures are disclosed which provide multiple layer interconnects and also include selectively positioned, reflective and/or energy absorptive layers for facilitating and selectively controlling the melting of the conductor layer while protecting other layers exposed to and irradiated by and/or otherwise heated by the irradiating energy beam.

REFERENCES:
patent: 4674176 (1987-06-01), Tuckerman
patent: 4758533 (1988-07-01), Magee et al.
patent: 4800179 (1989-01-01), Mukai
patent: 4920070 (1990-04-01), Mukai
D. B. Tuckerman et al., "Laser Planarization", Solid State Technology, vol. 29, No. 4, Apr. 1986, pp. 129-134.

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