Conductive pattern producing method and its applications

Details Conductive pattern producing method and its applications Conductive pattern producing method and its applications

2007-10-30

2007-10-30

Fahmy, Wael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S108000, C438S611000, C438S613000, C156S291000, C029S832000, C029S836000

Reexamination Certificate

active

11048767

ABSTRACT:
An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the first conductive film which, besides, would produce open circuits in the pattern.

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