Conductive pattern layer structure and method of producing the c

Details Conductive pattern layer structure and method of producing the c Conductive pattern layer structure and method of producing the c

1992-11-04

1994-02-08

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428212, 430 5, B32B 900

Patent

active

052846962

ABSTRACT:
A conductive pattern layer structure includes an insulating member containing polyimide, a patterned thin film formed on the insulating member, and a patterned conductive layer formed on the thin film. The patterned conductive layer contains copper. Further, the layer structure includes a patterned barrier layer covering an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

REFERENCES:
patent: 4411972 (1983-10-01), Narken et al.
patent: 4720442 (1988-01-01), Shinkai et al.

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