Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2011-08-02
2011-08-02
Kopec, Mark (Department: 1764)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S519300, C252S520300, C252S521600, C252S518100, C106S001130, C106S001140, C977S773000, C977S775000, C977S777000, C977S788000
Reexamination Certificate
active
07988886
ABSTRACT:
A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; inositol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.050 to 0.70;H=OH(A)Mw(A)X(A)+OH(B)Mw(B)X(B)Formula(I)where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl groups in one molecule of the inositol, Mw(B) represents a molecular weight of the inositol, and X(B) represents a content of the inositol in the conductive pattern forming ink in weight percent.
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Global IP Counselors, LLP
Kopec Mark
Nguyen Tri V
Seiko Epson Corporation
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