Conductive pattern formation ink, conductive pattern and...

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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Details

C106S001180, C106S001190, C106S001210, C252S513000, C252S514000, C252S500000

Reexamination Certificate

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07972538

ABSTRACT:
A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.

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