Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-04-26
2011-04-26
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S601000, C029S602100, C029S516000, C029S825000, C029S846000, C340S572700
Reexamination Certificate
active
07930815
ABSTRACT:
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
REFERENCES:
patent: 2702123 (1955-02-01), Injeski, Jr
patent: 3324014 (1967-06-01), Modjeska
patent: 4053370 (1977-10-01), Yamashita et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4323441 (1982-04-01), Schaer et al.
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4455181 (1984-06-01), Lifshin et al.
patent: 4462873 (1984-07-01), Watanabe
patent: 4525416 (1985-06-01), Hammerschmidt et al.
patent: 4597836 (1986-07-01), Schaer et al.
patent: 4789438 (1988-12-01), Polan
patent: 4790902 (1988-12-01), Wada et al.
patent: 4889584 (1989-12-01), Wada et al.
patent: 5049221 (1991-09-01), Wada et al.
patent: 5096522 (1992-03-01), Kawachi et al.
patent: 5153983 (1992-10-01), Oyama
patent: 5158604 (1992-10-01), Morgan et al.
patent: 5316974 (1994-05-01), Crank
patent: 5437916 (1995-08-01), Morgan et al.
patent: 5541570 (1996-07-01), McDowell
patent: 5545291 (1996-08-01), Smith et al.
patent: 5564888 (1996-10-01), Doan
patent: 5621199 (1997-04-01), Calari et al.
patent: 5783856 (1998-07-01), Smith et al.
patent: 5800650 (1998-09-01), Anderson et al.
patent: 5824186 (1998-10-01), Smith et al.
patent: 5854480 (1998-12-01), Noto
patent: 5886877 (1999-03-01), Shingai et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 5939984 (1999-08-01), Brady et al.
patent: 5969422 (1999-10-01), Ting et al.
patent: 5972152 (1999-10-01), Lake et al.
patent: 5985760 (1999-11-01), Lauffer et al.
patent: 5994034 (1999-11-01), Maehata
patent: 6001211 (1999-12-01), Hiroyuki
patent: 6107920 (2000-08-01), Eberhardt et al.
patent: 6133070 (2000-10-01), Yagi et al.
patent: 6145901 (2000-11-01), Rich
patent: 6147605 (2000-11-01), Vega et al.
patent: 6172609 (2001-01-01), Lu et al.
patent: 6204764 (2001-03-01), Maloney
patent: 6206292 (2001-03-01), Robertz et al.
patent: 6210537 (2001-04-01), Murphy et al.
patent: 6236316 (2001-05-01), Eberhardt et al.
patent: 6239983 (2001-05-01), Shingai et al.
patent: 6246327 (2001-06-01), Eberhardt
patent: 6259408 (2001-07-01), Brady et al.
patent: 6262692 (2001-07-01), Babb
patent: 6265977 (2001-07-01), Vega et al.
patent: 6271793 (2001-08-01), Brady et al.
patent: 6274508 (2001-08-01), Jacobsen et al.
patent: 6281038 (2001-08-01), Jacobsen et al.
patent: 6291896 (2001-09-01), Smith
patent: 6316278 (2001-11-01), Jacobsen et al.
patent: 6350957 (2002-02-01), Shingai et al.
patent: 6378199 (2002-04-01), Yoshinuma et al.
patent: 6380729 (2002-04-01), Smith
patent: 6384727 (2002-05-01), Diprizio et al.
patent: 6392544 (2002-05-01), Collins et al.
patent: 6407665 (2002-06-01), Maloney
patent: 6417025 (2002-07-01), Gengel
patent: 6421013 (2002-07-01), Chung
patent: 6437985 (2002-08-01), Blanc et al.
patent: 6451154 (2002-09-01), Grabau et al.
patent: 6476775 (2002-11-01), Oberle
patent: 6532651 (2003-03-01), Andou et al.
patent: 6602739 (2003-08-01), Rose et al.
patent: 6664169 (2003-12-01), Iwasaki et al.
patent: 6886246 (2005-05-01), Chung
patent: 6933892 (2005-08-01), Oberle
patent: 6951602 (2005-10-01), Reuter et al.
patent: 2001/0006368 (2001-07-01), Maloney
patent: 2001/0054755 (2001-12-01), Kirkham
patent: 2002/0035701 (2002-03-01), Casebolt et al.
patent: 2002/0145520 (2002-10-01), Maloney
patent: 2003/0029921 (2003-02-01), Akita et al.
patent: 2004/0090380 (2004-05-01), Luch
patent: 2004/0200061 (2004-10-01), Coleman et al.
patent: 2005/0133375 (2005-06-01), Schmid et al.
patent: 2005/0183264 (2005-08-01), Eckstein et al.
patent: 0896706 (2000-06-01), None
patent: 1039543 (2000-09-01), None
patent: 1548639 (2005-06-01), None
patent: 842789 (1960-07-01), None
patent: 2003/223626 (2003-08-01), None
patent: 2004/214419 (2004-07-01), None
patent: WO 82/00541 (1982-02-01), None
patent: WO 92/21790 (1992-12-01), None
patent: WO 93/05489 (1993-03-01), None
patent: WO 00/16277 (2000-03-01), None
patent: WO 00/16280 (2000-03-01), None
patent: WO 00/41148 (2000-07-01), None
patent: WO 01/73864 (2001-04-01), None
patent: WO 01/50547 (2001-07-01), None
patent: WO 01/71686 (2001-09-01), None
patent: WO 01/80174 (2001-10-01), None
patent: WO 03/056509 (2003-07-01), None
patent: WO 2004/038793 (2004-05-01), None
patent: WO 2004/080139 (2004-09-01), None
patent: WO 2005/056881 (2005-06-01), None
patent: 2006078147 (2006-07-01), None
E.W. Brooman et al. A New Manufacturing Technique for Flexible Circuitry, Electronic Packaging & Production, vol. 21, (Aug. 1981), pp. 147, 148, 150, 152, and 154-156.
G.R. Schaer et al. Some Commercial Applications of Hi-Speed Electrodeposition, Summer National AICHE Meeting, (Aug. 29-Sep. 1, 1982), Cleveland, Ohio.
Novel Equipment for Electroforming Flexible Circuits, Products Finishing, (Mar. 1981), pp. 90-92.
Coleman James P.
Edwards David N.
Forster Ian J.
Iyer Pradeep S.
Licon Mark A.
Avery Dennison Corporation
Banks Derris H
Nguyen Tai
LandOfFree
Conductive pattern and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive pattern and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive pattern and method of making will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2663382