Conductive paste multilayered board including the conductive...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reexamination Certificate

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Details

C252S513000, C252S514000, C252S519540, C174S257000, C174S264000, C427S097100, C427S372200, C148S023000, C148S024000

Reexamination Certificate

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10516236

ABSTRACT:
A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding to the end faces of conductive layers in the through-hole. Therefore, the paste does not require through-hole plating. The conductive paste comprises (A) 100 parts by weight of a resin component that contains an acrylate resin and an epoxy resin, (B) from 200 to 1800 parts by weight of a metal powder of at least two metals that contain at least one low-melting-point metal having a melting point of not higher than 180° C. and at least one high-melting-point metal having a melting point of not lower than 800° C., (C) from 0.5 to 40 parts by weight of a curing agent that contains from 0.3 to 35 parts by weight of a phenol-type curing agent, and (D) from 0.3 to 80 parts by weight of a flux.

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