Conductive paste for via conductor, ceramic wiring board...

Details Conductive paste for via conductor, ceramic wiring board... Conductive paste for via conductor, ceramic wiring board...

2006-10-17

2006-10-17

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

C252S512000, C252S513000, C252S519540, C252S062200, C156S089180, C156S089110, C216S013000, C216S017000, C216S018000, C361S303000, C428S357000

Reexamination Certificate

active

07122131

ABSTRACT:
The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.

REFERENCES:
patent: 6827880 (2004-12-01), Ishimatsu
patent: 2001/0001481 (2001-05-01), Sanada et al.
patent: 2003-229325 (2003-08-01), None

Affiliated with

Also associated with

Rating

Conductive paste for via conductor, ceramic wiring board... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive paste for via conductor, ceramic wiring board..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive paste for via conductor, ceramic wiring board... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3633749