Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2006-03-28
2006-03-28
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Having organic semiconductive component
C257S678000
Reexamination Certificate
active
07018864
ABSTRACT:
A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.
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Copy of Japanese Examination Report dated Oct. 18, 2005.
Hamada Kunihiko
Miki Takeshi
Noda Satoru
Dickstein Shapiro Morin & Oshinsky LLP.
Murata Manufacturing Co. Ltd.
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