Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-09-09
2008-09-09
Lam, Cathy F. (Department: 1794)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C428S210000, C361S751000, C252S510000, C252S511000
Reexamination Certificate
active
11476177
ABSTRACT:
A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent, wherein the organic solvent contains at least one solvent selected from an alkylene glycol diacetate and an alkylene glycol dipropionate. A multilayer electronic component is obtained by firing at high temperature an unfired laminate prepared by alternately stacking ceramic green sheets and internal electrode paste layers in which each of the internal electrode paste layers is formed by the above conductive paste. The conductive paste has appropriate viscosity characteristics and long-term stability, which allows manufacturing highly reliable multilayer electronic components having excellent electrical characteristics, without causing sheet attack.
REFERENCES:
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4547625 (1985-10-01), Tosaki et al.
patent: 4624934 (1986-11-01), Kokubu et al.
patent: 4764233 (1988-08-01), Ogihara et al.
patent: 4765929 (1988-08-01), Shaffer
patent: 4985376 (1991-01-01), Sunahara et al.
patent: 5336301 (1994-08-01), Tani et al.
patent: 6841493 (2005-01-01), Cho et al.
patent: 7018568 (2006-03-01), Tierney
patent: 7189341 (2007-03-01), Li et al.
patent: 1 509 071 (2005-02-01), None
patent: 7-21833 (1995-01-01), None
patent: 7-240340 (1995-09-01), None
patent: 9-17687 (1997-01-01), None
patent: 1 689 996 (1991-11-01), None
Higashi Kaori
Yoneima Toshio
Flynn ,Thiel, Boutell & Tanis, P.C.
Lam Cathy F.
Shoei Chemical Inc.
LandOfFree
Conductive paste for multilayer electronic components and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive paste for multilayer electronic components and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive paste for multilayer electronic components and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3924987