Conductive paste for filling via-hole, double-sided and multilay

Details Conductive paste for filling via-hole, double-sided and multilay Conductive paste for filling via-hole, double-sided and multilay

1999-05-04

2000-10-31

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

252512, 252513, 252514, 427 97, 361748, 428901, 1563063, 216 13, 430319, H01B 122, B05D 512, H05K 100

Patent

active

061397776

ABSTRACT:
A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.

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