Conductive paste for an electrode layer of a multi-layered...

Details Conductive paste for an electrode layer of a multi-layered... Conductive paste for an electrode layer of a multi-layered...

2004-11-24

2009-08-04

Cleveland, Michael (Department: 1792)

Coating processes

Electrical product produced

Reexamination Certificate

active

07569247

ABSTRACT:
It is an object of the present invention to provide a method for manufacturing a multilayered unit for a multi-layered ceramic electronic component which can reliably prevent short circuit failure from occurring 5 in a multi-layered ceramic electronic component. According to the present invention, a multi-layered unit for a multi-layered ceramic electronic component is fabricated by printing a conductive paste containing a butyral system resin as a binder and at least one solvent selected from a group consisting of dihydroterpinyl oxyethanol, terpinyl oxyethanol, d-dihydrocarveol, I-citronellol, I-perillylalcohol and acetoxy-methoxyethoxy-cyclohexanol acetate as a solvent on a ceramic green sheet containing an acrylic system resin as a binder in a predetermined pattern, thereby forming an electrode layer.

REFERENCES:
patent: 4415703 (1983-11-01), Toba et al.
patent: 5179773 (1993-01-01), Monsees et al.
patent: 5412865 (1995-05-01), Takaoka et al.
patent: 5480503 (1996-01-01), Casey et al.
patent: 5716481 (1998-02-01), Kobayashi et al.
patent: 5808856 (1998-09-01), Bischoff et al.
patent: 5840107 (1998-11-01), Salibay
patent: 5935358 (1999-08-01), Yamasaki
patent: 5985065 (1999-11-01), Kling
patent: 5985068 (1999-11-01), Kawakami et al.
patent: 6212064 (2001-04-01), Aoki et al.
patent: 6245171 (2001-06-01), Natarajan et al.
patent: 6563690 (2003-05-01), Kishi et al.
patent: 6607690 (2003-08-01), Anahara et al.
patent: 6773533 (2004-08-01), Hanai
patent: 6808577 (2004-10-01), Miyazaki et al.
patent: 7001539 (2006-02-01), Oda et al.
patent: 7318874 (2008-01-01), Roosen et al.
patent: 2002/0075632 (2002-06-01), Nakano et al.
patent: 2003/0096056 (2003-05-01), Kawamura et al.
patent: 2003/0138635 (2003-07-01), Haruta et al.
patent: 2006/0096693 (2006-05-01), Murosawa et al.
patent: 2006/0196592 (2006-09-01), Karatsu et al.
patent: 2006/0199883 (2006-09-01), Banba et al.
patent: 2006/0254701 (2006-11-01), Murosawa et al.
patent: 2007/0017091 (2007-01-01), Karatsu et al.
patent: 2007/0034841 (2007-02-01), Satou et al.
patent: 2008/0053593 (2008-03-01), Sato
patent: 1303104 (2001-07-01), None
patent: 57204866 (1982-12-01), None
patent: 3096207 (1991-04-01), None
patent: 3276710 (1991-12-01), None
patent: 4280614 (1992-10-01), None
patent: 4282812 (1992-10-01), None
patent: 5062860 (1993-03-01), None
patent: 05-325633 (1993-12-01), None
patent: 06053654 (1994-02-01), None
patent: 6072760 (1994-03-01), None
patent: 06085466 (1994-03-01), None
patent: 6206756 (1994-07-01), None
patent: 06224556 (1994-08-01), None
patent: 07-021832 (1995-01-01), None
patent: 07-021833 (1995-01-01), None
patent: 7312328 (1995-11-01), None
patent: 08-111346 (1996-04-01), None
patent: 8130152 (1996-05-01), None
patent: 08111346 (1996-06-01), None
patent: 08279438 (1996-10-01), None
patent: 09124771 (1997-05-01), None
patent: 10-275734 (1998-10-01), None
patent: 11053939 (1999-02-01), None
patent: 11238646 (1999-08-01), None
patent: 11273987 (1999-10-01), None
patent: 2000315618 (2000-11-01), None
patent: 2000331865 (2000-11-01), None
patent: 2001023853 (2001-01-01), None
patent: 2001044065 (2001-02-01), None
patent: 2001135138 (2001-05-01), None
patent: 2001162737 (2001-06-01), None
patent: 2001172594 (2001-06-01), None
patent: 2001237140 (2001-08-01), None
patent: 2002043164 (2002-02-01), None
patent: 3306814 (2002-07-01), None
patent: 2002270456 (2002-09-01), None
patent: 2002313672 (2002-10-01), None
patent: 2002343674 (2002-11-01), None
patent: 2003-017356 (2003-01-01), None
patent: 2003059759 (2003-02-01), None
patent: 2003-164992 (2003-06-01), None
patent: 2003249121 (2003-09-01), None
“RotoMill—Colloid Mills,” GlobalSpec, 1999, 2 pages.
Chinese Office Action relating to Chinese Patent Application No. 200480028461.4, issued Jan. 9, 2009, 2 pages.

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