Conductive paste compound for via hole filling, printed circuit

Details Conductive paste compound for via hole filling, printed circuit Conductive paste compound for via hole filling, printed circuit

1997-01-08

1999-11-02

Yoon, Tae

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174257, 174259, 524440, 252514, H05K 111, C08K 308

Patent

active

059774908

ABSTRACT:
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.
The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.

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A.K. Cousens et al., Microelectronics Journal, "Polymer Thick Film Systems and Surface Mount Techniques," vol. 18, No. 3, May/Jun. 1987, pp. 22-40.

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