Conductive paste compound for via hole filling, printed circuit

Details Conductive paste compound for via hole filling, printed circuit Conductive paste compound for via hole filling, printed circuit

1994-10-28

1997-07-29

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428323, 252511, 252514, 361749, B32B 900

Patent

active

056520425

ABSTRACT:
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.
The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.

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A. K. Cousens et al.; Microelectronics Journal, "Polymer Thick Film Systems and Surface Mount Techniques," vol. 18, No. 3, May/Jun. 1987, pp. 22-40.
Patent Abstracts of Japan, vol. 17, No. 583 (Oct. 22, 1993).

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