Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1997-03-10
1998-03-31
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, 216 33, B44C 122, C23F 100
Patent
active
057334676
ABSTRACT:
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
REFERENCES:
patent: 3983075 (1976-09-01), Marshall
patent: 4383363 (1983-05-01), Hayakawa
patent: 4598037 (1986-07-01), Felten
patent: 4634623 (1987-01-01), Watkins
patent: 4937148 (1990-06-01), Sato
patent: 4964948 (1990-10-01), Reed
patent: 4967314 (1990-10-01), Higgins, III
patent: 5117069 (1992-05-01), Higgins
patent: 5242511 (1993-09-01), Yokoyama
patent: 5326636 (1994-07-01), Durand
patent: 5346750 (1994-09-01), Hatakeyama
A.K. Cousens et al.; Microelectronics Journal, "Polymer Thick Film Systems and Surface Mount Techniques," vol. 18, No. 3, May/Jun. 1987, pp. 22-40.
Patent Abstracts of Japan, vol. 17, No. 583 (Oct. 22, 1993).
Akiyama Hideo
Iwaisako Kouichi
Kawakita Kouji
Nakatani Seiichi
Ogawa Tatsuo
Matsushita Electric - Industrial Co., Ltd.
Powell William
LandOfFree
Conductive paste compound for via hole filling, printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive paste compound for via hole filling, printed circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive paste compound for via hole filling, printed circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-48383