Conductive paste composition and method for producing a ceramic

Details Conductive paste composition and method for producing a ceramic Conductive paste composition and method for producing a ceramic

1998-04-29

1999-04-06

Kopec, Mark

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 8911, 156 8928, 252512, 25251921, 427123, C03B 2900, H01B 122, B05D 500

Patent

active

058912835

ABSTRACT:
A conductive paste composition comprises an organic vehicle, copper powder and an organometallic resinate which includes, as the metal, at least one metal selected from the group consisting of Pt, Ni and Bi. The amount of the metal component in the organometallic resinate is preferably in the range of about 0.1 to 5 wt % with respect to the total amount of the copper power and the metal component. The copper powder has preferably an average diameter in the range of about 2 to 30 .mu.m.

REFERENCES:
patent: 4599277 (1986-07-01), Brownlow
patent: 4808274 (1989-02-01), Nguyen
patent: 5378408 (1995-01-01), Carroll et al.

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