Conductive paste composition

Details Conductive paste composition Conductive paste composition

1991-04-08

1993-04-20

Bell, Mark L.

Compositions

Electrically conductive or emissive compositions

252512, 525482, 525483, 525484, 523137, 523457, 523458, 523459, H01B 122, C08L 6300

Patent

active

052040259

ABSTRACT:
A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.

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Database WPIL, No. 88-225 055, Derwent Publication Ltd., London (UK) & DW 8832 concerning to JP-A-63-161 015 (Sumitomo), Apr. 7, 1988.

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