Conductive paste as well as conductive coating and...

Compositions – Electrically conductive or emissive compositions – Free metal containing

Reexamination Certificate

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Details

C252S514000, C524S779000, C524S785000

Reexamination Certificate

active

07998370

ABSTRACT:
The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 μm˜125 μm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

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patent: 6406746 (2002-06-01), Date et al.
patent: 6666994 (2003-12-01), Takezawa et al.
patent: 2008/0050513 (2008-02-01), Wang et al.
patent: S60-118745 (1985-06-01), None
patent: H02-167741 (1990-06-01), None
patent: H02-245071 (1990-09-01), None
patent: 11-007830 (1999-01-01), None
patent: 2004-039379 (2004-02-01), None

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