Conductive paste and semiconductor ceramic components using the

Details Conductive paste and semiconductor ceramic components using the Conductive paste and semiconductor ceramic components using the

1995-07-07

1996-10-08

Bell, Mark L.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

501 19, 501 32, 252512, 252518, 427 58, 4273722, 428210, 428697, 428699, 428701, 428702, 428432, 428426, 174257, C03C 818

Patent

active

055629725

ABSTRACT:
A conductive paste capable of forming an excellent moisture-resistant electrode with a favorable ohmic contact formed between the electrode and the semiconductor element, said conductive paste comprising an aluminum powder and a glass frit containing at least one compound selected from the group consisting of barium borosilicate and calcium borosilicate as the principal component thereof, said glass frit accounting for 5 to 40% by weight with respect to the aluminum powder. Also claimed is a semiconductor ceramic component using the same.

REFERENCES:
patent: 3203815 (1965-08-01), Michael
patent: 3772043 (1973-11-01), Michael
patent: 4039721 (1977-08-01), Weitze et al.
patent: 4221604 (1980-09-01), Chirino et al.
patent: 4537703 (1985-08-01), Hormadaly
patent: 4699831 (1987-10-01), Hartmann et al.
patent: 5344592 (1994-09-01), Wilczek et al.
patent: 5358666 (1994-10-01), Sasaki

Affiliated with

Also associated with

Rating

Conductive paste and semiconductor ceramic components using the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive paste and semiconductor ceramic components using the , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive paste and semiconductor ceramic components using the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-55784