Conductive paste and method for producing ceramic substrate usin

Details Conductive paste and method for producing ceramic substrate usin Conductive paste and method for producing ceramic substrate usin

1999-03-25

2000-09-19

Gupta, Yogendra

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252512, 2525181, 156 8911, 156 8918, H01B 106

Patent

active

06120708&

ABSTRACT:
A conductive paste for forming via-holes in a ceramic substrate, which paste contains about 80-94 wt. % spherical or granular conductive metal powder having a particle size of about 0.1-50 .mu.m, 1-10 wt. % resin powder which swells in a solvent contained in the conductive paste and has a particle size of about 0.1-40 .mu.m, and about 5-19 wt. % an organic vehicle. The paste hardly generates cracks during firing to thereby attain excellent reliability in electric conduction and which can provide a via-hole or through hole having excellent solderability and platability. A method for producing a ceramic substrate making use of the paste is also disclosed.

REFERENCES:
patent: 5236630 (1993-08-01), Mutsumi, et al.
patent: 5242511 (1993-09-01), Yokoyama et al.
patent: 5814248 (1998-09-01), Hiroji, et al.
patent: 5891283 (1999-04-01), Tani et al.
Section Ch. Week 8013 Derwent Publications Ltd., London GB, Class A94A, AN 80-22631C, XP002115834 & JP 55 021204 (Sumitomo Bakelite Co.), Feb. 15, 1980, Abstract.

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