Conductive paste and circuit substrate formed by use of the past

Details Conductive paste and circuit substrate formed by use of the past Conductive paste and circuit substrate formed by use of the past

2000-01-19

2000-12-05

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, H01B 122

Patent

active

061562378

ABSTRACT:
A conductive paste including an organic binder having an acidic functional group; an inorganic powder containing glass and/or ceramic; a conductive metallic powder; and a mono-ol compound having a boiling point of about 178.degree. C. or higher. At least one of the inorganic powder and the conductive metallic powder contains a multivalent metal. The paste is useful in the formation of a fine and minute thick-film conductive pattern having strong adhesion to a substrate.

REFERENCES:
patent: 5914358 (1999-06-01), Kawakita et al.

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