Conductive paste and ceramic multilayer substrate

Details Conductive paste and ceramic multilayer substrate Conductive paste and ceramic multilayer substrate

2007-01-30

2007-01-30

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C428S407000, C428S901000

Reexamination Certificate

active

10799778

ABSTRACT:
A conductive paste used for forming conductive sinters includes a mixture of a copper powder coated with a metal oxide and a metal oxide powder, and an organic vehicle. The content of the metal oxide used for coating the copper powder is in the range of about 0.05% by weight to about 5% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder, and in addition, the total content of the metal oxide used for coating the copper powder and the metal oxide powder is in the range of about 1% by weight to about 12% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder.

REFERENCES:
patent: 4521329 (1985-06-01), Siuta et al.
patent: 5126915 (1992-06-01), Pepin et al.
patent: 62-133002 (1987-06-01), None
patent: 08-007646 (1996-01-01), None
patent: 08-031229 (1996-02-01), None
patent: 09-199857 (1997-07-01), None
patent: 11-353939 (1999-12-01), None
patent: 2000-345201 (2000-12-01), None
patent: 2003-016832 (2003-01-01), None
“1st 1997 IEMT/IMC Symposium Brochure, sponsored by IEEE CPMT Society & SHM: The Microelectrics Society”; Apr. 16-18, 1997; pp. 1-14.

Affiliated with

Also associated with

Rating

Conductive paste and ceramic multilayer substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive paste and ceramic multilayer substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive paste and ceramic multilayer substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3759153