Conductive paste

Details Conductive paste Conductive paste

1999-06-08

2000-07-04

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

252511, 2525193, 338 22R, 338223, H01B 100, H01C 710

Patent

active

060834269

ABSTRACT:
A conductive paste having excellent printing properties, which can be used for manufacturing heat-resistant conductors and resistive elements, is described. Such a conductive paste can be obtained by preparing as a binder a polyimide precursor whose weight average degree of polymerization (n) ranges from 5 to 20, and mixing it with a solvent and a conductive powder. The polyimide precursor preferably is included in the range from 50 to 80 weight parts to 100 weight parts of the solvent. A polar solvent, or a mixed solvent including a polar solvent and a nonpolar solvent can be used. A preferable mixed solvent is a mixture of N-methyl-2-pyrrolidone and diethylene glycol dimethyl ether, in which the mixing volume ratio is preferably ranging from 2:8 to 9:1, more preferably, 2:8 to 3:7.

REFERENCES:
patent: 4686144 (1987-08-01), Hupfer et al.
patent: 5475359 (1995-12-01), Hatayama et al.
patent: 5502143 (1996-03-01), Oie et al.

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