Conductive paste

Details Conductive paste Conductive paste

2007-12-20

2011-11-22

Nguyen, Khanh Tuan (Department: 1766)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S500000, C252S513000, C106S001130, C106S031180, C106S031410, C338S025000, C338S262000

Reexamination Certificate

active

08062558

ABSTRACT:
This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization.

REFERENCES:
patent: 3745507 (1973-07-01), Ishida et al.
patent: 0170063 (1986-02-01), None
patent: 61-003154 (1986-01-01), None
patent: 63-286477 (1988-11-01), None
patent: 01-158081 (1989-06-01), None
patent: 04-214777 (1992-08-01), None
patent: 04-345701 (1992-12-01), None
patent: 08-073780 (1996-03-01), None
patent: 2006-260951 (2006-09-01), None
Extended European Search Report for corresponding EP Application No. 07859652.5-2102, Jun. 6, 2011.

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