Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2006-04-11
2006-04-11
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S518100, C428S403000
Reexamination Certificate
active
07025906
ABSTRACT:
A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230° C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230° C. and/or a thermoplastic resin having a melting point that is lower than 230° C.
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Shimizu Kozo
Yamagishi Yasuo
Armstrong, Kratz, Quntos, Hanson & Brooks, LLP
Kopec Mark
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